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Copper Interconnects for Advanced Performance and Reliability (CopPeR)

Start date: Jan 1, 2008, End date: Nov 30, 2010,

The CopPeR project will provide a novel copper deposition process based on the useof non-aqueous solvents to overcome the limitations of currently employedinterconnect formation processes enabling device scaling beyond the 32 nmtechnology node. This non-aqueous process will open novel routes to implementdirect on barrier plating, focussing on tantalum and ruthenium as diffusion barriers.As another ...
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