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Materials for a Magnetic Memory in Three Dimensions (M3d)

Start date: Dec 1, 2012, End date: Nov 30, 2016,

...otential for innovation. Two SMEs are partners, one for material development (SmartMembranes, world leader in self-organized anodized products), and the European leader in Magnetic-RAM development, Crocus Technology.
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 FINISHED 
...ication temperatures have to be mastered for the first time. This will be achieved by combining TSV and HV-CMOS technology from ams with CMOS and Cu-TSV technology from CEA-Leti, MRAM technology from Crocus and WLP technology from Besi. Platform scalability will be proven by flipchip packaging of 14nm CMOS samples on the interposer. New modules for TSVs, MRAM and Passives embedded in TSV technolo ...
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