Generic Technologies for WDM Transmitter Photonic
Integrated Circuits
(GeTPICs)
Start date: Jan 1, 2014,
End date: Dec 31, 2017
PROJECT
FINISHED
The project aims at achieving the improvement of Photonic Integrated Circuit (PIC) building blocks (BBs) for generic integration technology, the design and fabrication of high bit-rate transmitter PICs, typically WDM 10x 25Gbps and 4x 25GBau Tx PIC as test vehicles for the deve-loped BBs, and finally the test and validation of the fabricated PICs in a transmission environment. The program addresses a significant step beyond the present state-of-the-art.To achieve these goals, both partners have adequate infrastructure and complementary means. Some challenging milestones will be set to be reached, such as deep UV stepper lithography; assessment of semi-insulating (SI)-substrate based technology; SAG (Selective Area Growth) epitaxy techniques; SiBH (Semi-Insulating Buried Hetero-structure); advanced RF (radio-frequency) circuit engineering. The test vehicles will be validated in transmission systems, and potential markets for the developed PICs will be explored.
Get Access to the 1st Network for European Cooperation
Log In
or
Create an account
to see this content
Coordinator
III-V LAB
€ 63 211,48- Denis Mazerolle
- 1 AVENUE AUGUSTIN FRESNEL CAMPUS POLYTECHNIQUE 91767 PALAISEAU CEDEX (France)
Details
- 100% € 718 318,46
-
FP7-PEOPLE
- Project on CORDIS Platform
1 Partners Participants
TECHNISCHE UNIVERSITEIT EINDHOVEN
€ 655 106,98- Suzanne Udo
- GROENE LOPER 5 5612 AE EINDHOVEN (Netherlands)