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6 European Projects Found

Searched on 125080 European Projects

 FINISHED 
Charge storage has been the main physical mechanism supporting all solid state mass storage memories until now, both DRAM and FLASH. However none of the two main memory types appear to fully satisfy system requirements, DRAM because of its volatility and large power dissipation, and FLASH because of its slow programming speed and large block organization. PCM technology is a promising candidate to ...
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 6

 FINISHED 

Semiconductor Equipment Assessment Leveraging Innovation (SEAL)

Start date: Jun 1, 2010, End date: Sep 30, 2013,

Description Seal is an EC-funded project covering semiconductor equipment assessment to strengthen the European semiconductor equipment industry. SEAL is an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing equipment. The assessment th ...
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 39

 FINISHED 

Magnetic Nanowires for High Density Non Volatile Memories (MAGWIRE)

Start date: Oct 1, 2010, End date: Sep 30, 2013,

Fast, high capacity, low form factor and low power non-volatile memories are a crucial enabler of today's ICT. They are already an important part of all electronic systems, representing a growing market segment, and should increase their importance in the future en route towards the "Storage everywhere" society. The market today is divided between Flash NAND and hard disk, which both face severe l ...
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 9

 FINISHED 

Extended Large (3D) Integration TEchnology (ELITE)

Start date: Nov 1, 2007, End date: Aug 31, 2011,

Description 3-D integration in high performance digital systems For developing complex next-generation chips which include a combination of disparate technologies, the circuit integration exclusively in two dimensions has proved to be a seriously limiting factor. Utilising the third dimension for ...
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 6

 FINISHED 

Gigascale Oriented Solid State flAsh Memory for EuRope (GOSSAMER)

Start date: Jan 1, 2008, End date: Jun 30, 2011,

Description GOSSAMER successfully developed a fully integrated Flash NAND technology based on the TANOS concept, investigating a large number of architecture and material options. The project aimed at the development of the technology for very high density Non Volatile Memories for mass storage ap ...
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 21

 FINISHED 
Today advanced System-in-Package(SiP) can integrate several Large-Scale-Integration(LSI) technologies and functionalities (advanced System-on-Chip-SoC),high-density memories,high-performance analogue-block.It's become strategic to analize and detect potential signal and power integrity failures before the prototype phase.The key to success is a set of integrated EDA tools and modelling flows that ...
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 6