4 European Projects Found
Searched on 125080 European Projects
FINISHED
Support Action for 450mm topics establishing a Bridge between European EM entities and IDMs, Foundries and Entities Worldwide (Bridge450)
Start date: Nov 1, 2013, End date: Oct 31, 2016,
...ts E&M companies are striving for leadership in each of their fields.The ENIAC Coordination Action Enable450 began in 2012 to assist European 450mm programmes with data collection, standards, G450C liaison, dissemination of 450mm topics and other activities. The Bridge450 Support Action seeks to run in parallel with Enable450 to expand its scope with more focus on Asian semiconductor manufacture. ...
Read Project
12
Partners Participants
FINISHED
European 450mm Equipment Demo Line (E450EDL)
Start date: Oct 1, 2013, End date: Sep 30, 2016,
The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative and proceeded with subsequent projects funded with public money, amongst others NGC450, SOI450, EEM450PR. The demo line resulting from this project will be such that it will enable first crit ...
Read Project
44
Partners Participants
FINISHED
European E&M 450mm Pilotline Readiness (EEM450PR)
Start date: Apr 1, 2012, End date: Mar 1, 2015,
Aim of the EEM450PR project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative. It will also bring about the start of a vision to place an equipment development pilot line in the imec facility in Leuven. This will provide Europe with a complementary activity for 450mm equi ...
Read Project
32
Partners Participants
FINISHED
European 450mm Equipment & Materials Initiative (EEMI 450)
Start date: Apr 1, 2010, End date: Mar 1, 2013,
Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, major chipmakers are considering offsetting the growing costs of miniaturisation by increasing wafer size to 450mm to cut cost per produced die. A prerequisite is the availability of the required quality wafers and equipment able to handle larger wafers. The EN ...
Read Project
