SMARTIEHS develops a smart, high-speed, cost effective and flexible inspection system for production of Micro(Opto)ElectroMechanicalSystems (M(O)EMS). SMARTIEHS decreases the inspection time of a wafer by a factor of 100. It cuts production costs and shorten the time to market.To achieve this, SMARTIEHS develops an innovative measurement concept: a probing wafer consisting of an array of micro optical sensors is adapted to and aligned with the wafer under test. The design and production of the micro-optical interferometer array inspects 100 M(O)EMS structures within only one measurement cycle. A multifunctional approach of the measurement concept allows the inspection of passive and active parameters within one inspection system. A novel smart pixel detector array is developed.SMARTIEHS provides a multifunctional design with two interferometer configurations; a low coherent interferometer and a laser interferometer. The project focuses on the measurement of shape and deformation, resonance frequency and vibration amplitude distribution.The SMARTIEHS technology will be validated and demonstrated with industrial end users.The work in SMARTIEHS will be organised in eight work packages: Project management, Inspection system design, Micro-optical interferometer system design, Micro-optical wafer production, Smart pixel camera development, inspection system integration, Inspection system test and validation, Exploitation and dissemination.The SMARTIEHS consortium has RTD partners and industrial users: SINTEF (low-coherence interferometry, micro optics), WUT (laser interferometry, micro optics), Fraunhofer (production of Diffractive Optical Elements), CNRS (production of refractive optics, micro lenses), CSEM (design and production of smart pixel detector arrays), Heliotis (exploitation), IMMS (macro design of the inspection system), and Techfab (end user and validation).SMARTIEHS lasts 38 months and has a budget of 3,77M�. Requested EC contribution is 2,85 M�