Heterogeneous integration of autonomous smart film.. (SMART-EC)
Heterogeneous integration of autonomous smart films based on electrochromic transistors
(SMART-EC)
Start date: Sep 1, 2010,
End date: Aug 31, 2014
PROJECT
FINISHED
SMART-EC aims at the development of self powered (energy harvesting and storage) EC device integrating EC thin film transistor component on a flexible substrate for energy saving, comfort and security in automotive, e-cards and smart packaging sectors.The objective is to overcome the current limitations related to low switching time and manufacturing costs; the switching time can be reduced (<1s) by introducing nanostructured EC materials, innovative EC transistors and high ionic conductive solid electrolytes. Radical innovative cheap manufacturing technologies on large area PVD, inkjet and roll-to-roll processes on low cost plastic will be developed. These processes are fully compatible with heterogeneous integration of several functions to produce a completely autonomous device (thin film battery, PV cell, sensors and communication) with great added value respect to traditional solutions. The optimization of co-integrated (separated building blocks laminated together) and convergence (using same materials for different building blocks) approaches will allow to fabricate a fully autonomous system. The first step will be the optimization of deposition and patterning technologies in terms of processes parameters and in-situ monitoring to allow the high control of film growth; the second step will be the heterogeneous integration of the different building blocks to produce the self-powered systems for the targeted applications.Four academic and research institutes guarantee a high level interdisciplinary research on solid-state physics, material chemistry and integration; this will assures the proper technology transfer to industrial partners at all product chain levels (materials, devices and end users) for a successful exploitation of results. SMART-EC materials and technologies are original and will pave the way for future generation smart surfaces with great potential impact at medium and long term (flexible and transparent electronics) applications.
Get Access to the 1st Network for European Cooperation
Log In