Development, construction, integration, and progre.. (AEROL-HP)
Development, construction, integration, and progress toward to two-phase device monitoring and qualification on aircrafts
(AEROL-HP)
Start date: Oct 1, 2011,
End date: Dec 31, 2014
PROJECT
FINISHED
The proposed project is part of the Cleansky Eco-Design activities for the all (or more) electric aircrafts. The main targets of the call are related to improved aircraft weight, improved electronic equipment life cycles & reduced maintenance thanks to the use of highly efficient passive (“green”) thermal control systems (as already used on satellite systems).Technical objectives:The EHP proposal is part of the ECO-Design ITD and will address the development, and qualification aspects of highly efficient two-phase cooling devises such as heat pipes and loop heat pipes to be used on board of aeronautical aircrafts.The main objectives are :• Qualify two-phase heat transfer devises in accordance with specific aeronautical requirements such as :o High acceleration loadso Long duration vibration stresses• Reduce global aircraft weight at equipment and/or system level => reduce aircraft consumption and increase operating range• Lower impact on environment through the use of passive and maintenance free thermal equipments• Increase reliability of controlled equipment (power electronics) => decrease repair and maintenance aspectsThe Ammonia HP and LHP products are today baselined (with a TRL 9) on all Space satellites or payloads thanks to the reliable capability provided by these “isothermal” lightweight thermal management devises.Non-space applications are also more and more considered for these two-phases devises to be used on high power electronic (railway applications) or primary flight control actuators.The AeroL-HP products will be developped up to CDR level with qualification of the two-phase hardware. From a technical side, the proposed thermal link will have to provide a reliable and competitive (generic, modular and low cost) product (Rejected power/mass). The thermal link will be a scalable system able to address payload dissipations from 30W (TBC) up to 900W (or higher).
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