Demonstration of a large, high temperature, flexib.. (LHTFPCB)
Demonstration of a large, high temperature, flexible printed circuit board
(LHTFPCB)
Start date: Mar 1, 2012,
End date: Dec 31, 2015
PROJECT
FINISHED
This Project aims to support Rolls Royce in the design of a of high temperature flexible PCB and through trials of flexible laminates manufactured from existing and brand new advanced polymers progress the temperature at which a flexible printed circuit can operate from the current state of the art maximum of 200°C into the desired range of 260°C (minimum) up to 400°C (target).The Project also aims to develop the materials and manufacturing processes that enable this high temperature performance in a large format, such that the required overall length of 5m can be implemented in a single piece multilayer printed circuit, without joints.Validation to TRL6 is to be achieved through coupon tests on representative hardware in a bespoke environmental chamber, subjecting the coupons to combined heat and random vibration loading, supported by full size PCBs integrated and tested at engine level.
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