4 European Projects Found
Searched on 125080 European Projects
FINISHED
Sensor based adaptive laser micromachining using ultrashort pulse lasers for zero-failure manufacturing (ADALAM)
Start date: Jan 1, 2015, End date: Dec 31, 2017,
Miniaturization, advanced high performance materials and functional surface structures are all drivers behind key enabling technologies in high added value production. It is in such areas that ultrashort pulse lasers have enabled completely new machining concepts, where the big advantages of laser machining are combined with a quasi non-thermal and therefore mild process, which can be used to mach ...
Read Project
11
Partners Participants
FINISHED
European 450mm Equipment Demo Line (E450EDL)
Start date: Oct 1, 2013, End date: Sep 30, 2016,
The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative and proceeded with subsequent projects funded with public money, amongst others NGC450, SOI450, EEM450PR. The demo line resulting from this project will be such that it will enable first crit ...
Read Project
44
Partners Participants
FINISHED
European E&M 450mm Pilotline Readiness (EEM450PR)
Start date: Apr 1, 2012, End date: Mar 1, 2015,
Aim of the EEM450PR project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative. It will also bring about the start of a vision to place an equipment development pilot line in the imec facility in Leuven. This will provide Europe with a complementary activity for 450mm equi ...
Read Project
32
Partners Participants
FINISHED
European 450mm Equipment & Materials Initiative (EEMI 450)
Start date: Apr 1, 2010, End date: Mar 1, 2013,
Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, major chipmakers are considering offsetting the growing costs of miniaturisation by increasing wafer size to 450mm to cut cost per produced die. A prerequisite is the availability of the required quality wafers and equipment able to handle larger wafers. The EN ...
Read Project
