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3 European Projects Found

Searched on 125080 European Projects

 FINISHED 

Coordination Action to enable an effective European 450 mm Equipment & Materials Network (ENABLE450)

Start date: Nov 1, 2012, End date: Oct 31, 2016,

5 major global semiconductor companies Intel, Samsung, TSMC, IBM and Global Foundries, have decided to work closely together to bring 450 mm semiconductor processing to a mature level, within a consortium called G450C. This operation, based in Albany N.Y., is currently ordering and installing the first wave of 450 mm systems. The major drivers of this effort are Intel and TSMC, which have provide ...
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 13

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Support Action for 450mm topics establishing a Bridge between European EM entities and IDMs, Foundries and Entities Worldwide (Bridge450)

Start date: Nov 1, 2013, End date: Oct 31, 2016,

Five major global semiconductor companies are working in the G450C consortium based in Albany N.Y. to introduce 450mm wafer semiconductor processing and are now installing the first wave of 450mm prototype systems. Intel and TSMC lead this effort with published roadmaps showing pilot lines in 2016, production in 2018. Samsung will soon follow which will force GlobalFoundries, SK Hynix, Toshiba, UM ...
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 12

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Gigascale Oriented Solid State flAsh Memory for EuRope (GOSSAMER)

Start date: Jan 1, 2008, End date: Jun 30, 2011,

Description GOSSAMER successfully developed a fully integrated Flash NAND technology based on the TANOS concept, investigating a large number of architecture and material options. The project aimed at the development of the technology for very high density Non Volatile Memories for mass storage ap ...
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