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5 European Projects Found

Searched on 125080 European Projects

 FINISHED 

Graphene-based disruptive technologies (GrapheneCore1)

Start date: Apr 1, 2016, End date: Mar 31, 2018,

This project is the second in the series of EC-financed parts of the Graphene Flagship. The Graphene Flagship is a 10 year research and innovation endeavour with a total project cost of 1,000,000,000 euros, funded jointly by the European Commission and member states and associated countries. The first part of the Flagship was a 30-month Collaborative Project, Coordination and Support Action (CP-CS ...
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 158

 FINISHED 
...istributed pilot line between 2 companies: - Soitec for the fabrication of advanced engineered substrates (UTBB: Ultra Thin Body and BOx (buried oxide)) without and with strained silicon top film. - STMicroelectronics for the development and industrialization of state of the art FDSOI technology platform at 14nm and beyond with an industry competitive Power-Performance-Area-Cost (PPAC) trade-off. ...
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 32

 FINISHED 

Graphene-Based Revolutions in ICT And Beyond (GRAPHENE)

Start date: Oct 1, 2013, End date: Mar 31, 2016,

This Flagship aims to take graphene and related layered materials from a state of raw potential to a point where they can revolutionize multiple industries – from flexible, wearable and transparent electronics, to new energy applications and novel functional composites.Our main scientific and technological objectives in the different tiers of the value chain are to develop material technologies fo ...
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 154

 FINISHED 
Description SPADnet aims to develop a new generation of smart, CMOS-based large area networked image sensors for photon-starved biomedical applications, build ring-assembly modules for Positron Emission Tomography (PET) imaging, and carry out performance tests in a PET system evaluation testbed.While suited to applications offering repetitiv ...
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 9

 FINISHED 
The ENIAC JU project MIRANDELA is building a complete digital, mixed-signal, analogue, radio frequency (RF) and millimetre-wave (MMW) platform for the design and production of chips for future wireless communications to address the challenge of transferring anything, from/to anybody, anywhere, at any time and through any path. Components in core CMOS technology and other processes will be characte ...
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