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5 European Projects Found

Searched on 125080 European Projects

 FINISHED 

THINGS2DO (THINGS2D0)

Start date: Jan 1, 2014, End date: Jan 1, 2018,

Develop the FDSOI ecosystem in Europe, beyond the PLACES2BE Pilot Line, in order to increase the impact of this European technology. At the time of set up of the first KET pilot line the proof of FDSOI was mainly technological. In between then and now, the first realization of a complex silicon chip in FDSOI has shown to the worldwide microelectronics community the capabilities of this technology. ...
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 44

 FINISHED 

Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologies (WAYTOGO FAST)

Start date: May 1, 2015, End date: Apr 30, 2017,

The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (FDSOI) so as to compete in leading edge technology at node 14nm and beyond preparing as well the following node transistor architecture. Europe is at the root of this breakthrough technology in More Moore law. The project aims at establishing a distributed pilo ...
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 32

 FINISHED 

SMArt systems Co-design (SMAC)

Start date: Oct 1, 2011, End date: Mar 31, 2015,

Smart systems consist of heterogeneous subsystems and components providing different functionalities; they are normally implemented as "Multi-Package on a Board". To fully exploit the potential of current nanoelectronics technologies, as well as to enable the integration of existing/new IPs and "More than Moore" devices, smart system miniaturization and "Multi-Chip in a Package" implementation are ...
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 18

 FINISHED 

Methods for Advanced Multi-Objective Optimization for eDFY of complex Nano-scale Circuits (MANON)

Start date: Oct 1, 2010, End date: Sep 30, 2014,

Cost control, production efficiency, cycle time and yield are critical quality benchmark for nanoelectronics productions. An increasingly important downside of nano-CMOS technology scaling is the fact that the scaling of feature sizes cannot be accompanied by a suitable scaling of geometric tolerances.In addition, when getting into deep miniaturized dimensions, phenomena like edges or surfaces rou ...
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 4

 FINISHED 

Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future (THERMINATOR)

Start date: Jan 1, 2010, End date: Dec 31, 2012,

Electronic devices of the latest generations, being those integrated circuits or discrete components, are often required to operate in harsh environmental conditions, where the temperature may reach over hundred degrees centigrade. Obviously, this has negative impact on several parameters of the electronic devices, ranging from slow-down and transient, recoverable errors to permanent failures and ...
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 21