Search for European Projects

9 European Projects Found

Searched on 125080 European Projects

 FINISHED 

From Measurements to Standardized Multi-Domain Compact Models of LEDs (DELPHI4LED)

Start date: Jun 1, 2016, End date: May 31, 2019,

The European lighting industry aims at reducing cost, at continuously improving product performance while reducing time to market and enlarging the product. The main challenge for the design in of LED components into lighting systems is the temperature and current dependence of their performance. In order to achieve a good design of LED systems, a modular, multi-physics based modelling approach is ...
Read Project

 15

 FINISHED 

THINGS2DO (THINGS2D0)

Start date: Jan 1, 2014, End date: Jan 1, 2018,

Develop the FDSOI ecosystem in Europe, beyond the PLACES2BE Pilot Line, in order to increase the impact of this European technology. At the time of set up of the first KET pilot line the proof of FDSOI was mainly technological. In between then and now, the first realization of a complex silicon chip in FDSOI has shown to the worldwide microelectronics community the capabilities of this technology. ...
Read Project

 44

 FINISHED 

Analog SImulation and Variability Analysis for 14nm designs (ASIVA14)

Start date: Sep 1, 2013, End date: Aug 31, 2017,

"In recent years the demand of the electronics industry on mathematical methods used in EDA software has witnessed a tremendous growth. “The real world is analog and computers are digital.” These nine words set the stage for the great circuit design challenges of the next decade. To quote G. Dan Hutchenson, president of VLSI Research, “virtual reality is possible only with mixed-signal chips, and ...
Read Project

 2

 FINISHED 

Photonic Libraries And Technology for Manufacturing (PLAT4M)

Start date: Oct 1, 2012, End date: Mar 31, 2017,

Description "PLAT4M will make silicon photonics ready for transition to industry"Silicon is now a mature integration platform that has brought CMOS microelectronics to mass-market application. The PLAT4M vision is that silicon photonics will lead to a similar revolution in the photonics sector.Over the past years silicon photonics has see ...
Read Project

 18

 FINISHED 

Pilot Line For Self Assembly Copolymer Delivery (PLACYD)

Start date: Jan 1, 2014, End date: Jan 1, 2017,

The PLACYD project aims at strengthening the European leadership in the field of advanced lithography. The consortiums gathers the main European Rnull actors along the whole value chain (Material suppliers, equipment suppliers, semiconductor companies, CAD companies, research laboratories) in order to bring the key materials, processes and design tools for Directed Self Assembly (DSA) Lithography ...
Read Project

 11

 FINISHED 

Pilot Lines for Advanced CMOS EmbodimentS in 2x nodes, Built in Europe (PLACES2BE)

Start date: Dec 3, 2012, End date: Dec 31, 2015,

...tegral part of the Horizon 2020 strategy.Consortium: PLACES2BE Pilot line gathers 27 experienced partners, including industry leaders such as GLOBALFOUNDRIES, ARM, STEricsson, SOITEC, MENTOR Graphics along the microelectronics value chain, SMEs such as Open Engineering, eSilicon, GSS, Axiom, IBS, RTOs such as the Fraunhoger Gesellschaft, IMEC, and LETI, and several academic teams located in 8 Euro ...
Read Project

 22

 FINISHED 

Lithography Enhancement towards Nano Scale (LENS)

Start date: Jan 1, 2009, End date: Dec 1, 2011,

Water immersion lithography has been widely accepted as patterning technology for the 45nm technology node, but solutions for the patterning of 32nm and 22nm technology nodes are not clear yet.EUV lithography is not yet available for industrial use, in spite of the impressive progresses registered till now, while multiple beam e beam lithography is still in development. Double patterning seems to ...
Read Project

 12

 FINISHED 

Nano Packaging Technology for Interconnect and Heat Dissipation (NANOPACK)

Start date: Nov 1, 2007, End date: Sep 30, 2011,

One of the major limitations to continued performance increases in the semiconductor and power electronics industries is integration density and thermal management. Continued transistor downscaling is quickly reaching its limits forcing a new focus on heterogeneous integration and 3D packaging technologies to continue performance improvements by reducing interconnect length between memory and mult ...
Read Project

 17

 FINISHED 

Advancing Traffic Efficiency and Safety through Software Technology phase 2 (ATESST2)

Start date: Jul 1, 2008, End date: Jun 30, 2010,

Advanced automotive functions are increasingly dependent on software and electronics. The complexity and criticality of automotive embedded systems already constitute an inhibiting factor for further evolution of functionality. This is evident for single automotive systems and even more so for functions that interact between vehicles and between vehicle and infrastructure, cooperative systems. New ...
Read Project

 12