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Components for multi spectral, real-time, room-temperature operating imaging and spectroscopy for multiple application fields as security technology, transport, production technology, or health and life-science are proposed. The first objective of the project is the development of a multi spectral imaging sensor working in the visible, long wave infrared, and terahertz band of the electromagnetic ...

One of the major limitations to continued performance increases in the semiconductor and power electronics industries is integration density and thermal management. Continued transistor downscaling is quickly reaching its limits forcing a new focus on heterogeneous integration and 3D packaging technologies to continue performance improvements by reducing interconnect length between memory and mult ...