Search for European Projects

15 European Projects Found

Searched on 125080 European Projects

 FINISHED 

Imaging the Force of Cancer (FORCE)

Start date: Jan 1, 2016, End date: Dec 31, 2019,

Cancer is the second leading cause of mortality in EU member states with ~90% of all cancer deaths caused by metastatic spread. Despite its significance, measuring metastatic potential as well as potential indicators of therapy efficacy remain unmet clinical challenges. Recently, it has been demonstrated in vitro, that aggressive metastatic cells pull on their surroundings suggesting that metastat ...
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 18

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...ected to be 20 to 40 times the performance of the existing SoC for space and more than 2 times the performance of the future quad core LEON4 chip. This performance level, combined with a large set of integrated peripherals including dedicated on-chip functions for GNSS, TM and TC support, will enable key space applications to be executed within the same microprocessor significantly reducing cost a ...
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 7

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Extended Image Sensing Technologies (EXIST)

Start date: May 1, 2015, End date: Apr 30, 2018,

This project will research new technologies for CMOS image sensors that are needed in the next generation of several application domains.The image sensor research will focus on enhancing the capabilities of current imaging devices:• New design (architectures) and technology (e.g. 3D stacking) for better pixels (lower noise, higher dynamic range, new functionality within the pixel) and more pixels ...
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 17

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DEMETER

Start date: Sep 15, 2014, End date: Mar 15, 2018,

...high capacity, power dissipation, and high speed signal integrity. Optical links gives the solution to the new challenges of package to package interconnection up to 20GHz. Optical interfaces must be integrated in the package. The DEMETER project will bring unique innovative solutions by integrating all reprogrammable functions and protection through native code, directly on chip and in software. ...
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 14

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THINGS2DO (THINGS2D0)

Start date: Jan 1, 2014, End date: Jan 1, 2018,

Develop the FDSOI ecosystem in Europe, beyond the PLACES2BE Pilot Line, in order to increase the impact of this European technology. At the time of set up of the first KET pilot line the proof of FDSOI was mainly technological. In between then and now, the first realization of a complex silicon chip in FDSOI has shown to the worldwide microelectronics community the capabilities of this technology. ...
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 44

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The Automotive HMI (Human Machine Interface) will soon undergo dramatic changes, with large plastic dashboards moving from the ‘push-buttons’ era to the ‘tactile’ era. User demand for aesthetically pleasing and seamless interfaces is ever increasing, with touch sensitive interfaces now commonplace. However, these touch interfaces come at the cost of haptic feedback, which raises concerns regarding ...
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 9

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...s, IP providers, fabless design houses, and a system manufacturer. E&M will contribute to the objective of installing a pilot line capable of manufacturing both advanced SOI substrates and FDSOI CMOS integrated circuits at 14nm and beyond. Design houses and electronics system manufacturer will provide demonstrator and enabling IP, to spread the FDSOI technology and establish it as a standard in ...
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 32

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Micro Retina Thermal Infrared (MIRTIC)

Start date: Feb 1, 2012, End date: Jan 1, 2016,

The MIRTIC project goal is to respond to market expectation by developing and providing a new type of affordable low resolution IR sensor. This new line of IR sensors is designed to fill an unmet need in applications seeking to achieve maximum system efficiency in the everyday use of energy.The market trend is oriented on replacement of available single element IR sensor by a small 2 D array which ...
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 5

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The overall objective of IDEAS “Interactive Power Devices for Efficiency in Automotive with Increased Reliability and Safety”, - is to develop advanced packaging for power supply components and new generation memory systems having application on Electric and ICE propelled vehicles and aiming at covering complementary aspects which haven’t yet addressed into the main running ENIAC and ARTEMIS Aut ...
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 15

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iCargo IP aims at advancing and extending the use of ICT to support new logistics services that: (i) synchronize vehicle movements and logistics operations across various modes and actors to lower CO2 emissions, (ii) adapt to changing conditions through dynamic planning methods involving intelligent cargo, vehicle and infrastructure systems and (iii) combine services, resources and information fro ...
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 32

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...D will approach SPD at 4 different levels: node, network, middleware and overlay. For each level, the state of the art in SPD of single technologies and solutions will be improved and integrated (hardware and communication technologies, cryptography, middleware, smart SPD applications, etc.). The SPD technologies will be enhanced with the composable functionality that are being studied and designe ...
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 24

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...tend simply duplicates the circuitry for each band. Due to the severe signal constraints in a cell phone and limitations of the current technologies and architectures, it is not possible to create an integrated solution.A tunable RF frontend radio is required which can cover all bands and bandwidths in a range from 0.3GHz to 5GHz, meeting all specifications within a mobile device. This requires ho ...
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 41

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Secure Memories and Applications Related Technologies (SMART)

Start date: Jan 1, 2010, End date: Dec 1, 2013,

SMART Secure memories and applications-related technologies Growth in digital multimedia and in wired and wireless Internet- based services focuses attention on the need for protection of personal data and identification. Various electronic certification devices have been used – from magnetic-strip cards to increasingly sophisticated smart cards. Convergence of applications such as personal or pri ...
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 14

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The ENIAC JU project MIRANDELA is building a complete digital, mixed-signal, analogue, radio frequency (RF) and millimetre-wave (MMW) platform for the design and production of chips for future wireless communications to address the challenge of transferring anything, from/to anybody, anywhere, at any time and through any path. Components in core CMOS technology and other processes will be characte ...
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