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10 European Projects Found

Searched on 125080 European Projects

 FINISHED 
The White Paper on EU Transport Policy for 2010 states a key objective: 50% reduction of casualties due to road accidents by the end of 2010. Improvements on road safety are achievable increasing the EU market penetration of advanced driver assistance systems (ADAS), currently limited by performance and cost of sensor technologies.According to ICT-2007.6.1, ADOSE addresses research challenges in t ...
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 15

 FINISHED 

Gigascale Oriented Solid State flAsh Memory for EuRope (GOSSAMER)

Start date: Jan 1, 2008, End date: Jun 30, 2011,

Description GOSSAMER successfully developed a fully integrated Flash NAND technology based on the TANOS concept, investigating a large number of architecture and material options. The project aimed at the development of the technology for very high density Non Volatile Memories for mass storage ap ...
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 21

 FINISHED 

Wavelength Division Multiplexed Photonic Layer on CMOS (WADIMOS)

Start date: Jan 1, 2008, End date: Jun 30, 2011,

WADIMOS proposes to develop a generic technology for the realization of complex electro-photonic integrated ICs using standard CMOS processing technologies.These ICs will contain a photonic interconnect layer incorporating microsource arrays and ultracompact WDM (wavelength division multiplexing) functionality based on silicon nanophotonic wire circuits, driven directly from by the CMOS electronic ...
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 8

 FINISHED 
Description EUROSOI+ is a CSA project that upgrade the European network on silicon-on-insulator technology set up by the EUROSOI project.     In the framework of FP6, the European Commission supported the formation of a European Network on Silicon on Insulator Technology, Devices and Circuits, whose main goal was to create a discussion fo ...
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 9

 FINISHED 

Dual-channel CMOS for (sub)-22 nm high performance logic (DUALLOGIC)

Start date: Dec 1, 2007, End date: May 31, 2011,

We propose to develop for the first time a dual-channel CMOS technology comprising high channel mobility (high-µ) Ge pMOS and III-V compound semiconductor nMOS transistors co-integrated on the same complex engineered substrate on Si. This offers a high performance booster as an option for the 22 nm technology creating competitive advantage for the European nanoelectronics industry. In addition, hi ...
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 9

 FINISHED 

Flexible Autonomous Cost efficient Energy Source and Storage (FACESS)

Start date: Jan 1, 2008, End date: Apr 30, 2011,

In this project roll-to-roll printed organic solar cells (OSCs) and thin film batteries (TFBs) are developed, manufactured and integrated to a flexible autonomous cost efficient energy source. This kind of energy source concept has huge potential to be integrated into different low cost large area electronics applications such as posters, wireless keyboards, large-area sensor networks. In order to ...
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 8

 FINISHED 

Scalable Multi-tasking Baseband for Mobile Communications (Multi-Base)

Start date: Jan 1, 2008, End date: Apr 30, 2011,

In order to strengthen Europe's leading position in high-speed, end-to-end, mobile network systems technology, the Multi-Base consortium has identified three main areas where research will have a major impact on the advancement of state-of-the-art technology and the emergence of a sound competitive and innovative environment for the European communications and services industry:A)\tmulti-tasking r ...
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 7

 FINISHED 
NANOSIL Network of Excellence aims to integrate at the European level the excellent European research laboratories and capabilities in order to strengthen scientific and technological excellence in the field of nanoelectronic materials and devices for terascale integrated circuits (ICs) and disseminate the results in a wide scientific and industrial community.NANOSIL will explore and assess the sc ...
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 38

 FINISHED 

Heterojunction Solar Cells based on a-Si c-Si (HETSI)

Start date: Feb 1, 2008, End date: Jan 31, 2011,

"The Photovoltaic (PV) industry needs to find new approaches to make solar cells competitive. Crystalline silicon (c-Si) wafer-based technology has a real potential to achieve significant cost reduction if the R&D effort is made on the most critical issues. These issues are the reduction of silicon material consumption, the increase of solar cell efficiency and an improved integration into modules ...
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 12

 FINISHED 
Thin client solutions (i.e. processing delegated primarily to a remote server) have been extremely successful in wired LAN settings, because of cost reductions, inherent data security and privacy, more efficient use of resources, and ubiquitous data and service access.Despite the successes in the wired scenario, solutions able to also perform well in a wireless wide area network, still do not exis ...
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 8