4 European Projects Found
Searched on 125080 European Projects
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Smart integration of GaN & SiC high power electronics for industrial and RF applications (SMARTPOWER)
Start date: Sep 1, 2011, End date: Jan 31, 2016,
Description
Packaging and thermal management in an efficient and cost effective way for SiC and GaN-based power devicesFor industrial motor-drive, UPS and solar inverters applications and aerospace or telecom radio frequency applications, new emerging power semiconductor technologies, respectively SiC and GaN, have demonstrated their high ...
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15
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Nanostructured materials and RF-MEMS RFIC/MMIC technologies for highly adaptive and reliable RF systems (NANOTEC)
Start date: Sep 1, 2011, End date: Jul 31, 2015,
RF communication and remote sensing (radar/radiometric) systems are facing the demands ofincreasing complexity/number of frequency bands, increased bandwidths and higher frequencies forhigher data throughput, while at the same time the power consumption, the form factor of the systems,and the overall system costs need to be reduced. Smart micro-/mm-wave systems will have to achieveself-reconfigura ...
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17
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Microsystems Based on Wide Band Gap Materials for Future Space Transmitting Ultra Wideband Receiving Systems (SATURNE)
Start date: May 1, 2010, End date: Aug 31, 2013,
"The European Space Technology Platform mentioned in its last SRA a need to support non-dependence on critical technologies from outside Europe for future space applications. In particular, one action under bullet to reduce critical ITAR dependence is to secure access to high-performance microwave components used in satellite communication/navigation payloads, and earth observations/science instru ...
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6
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Nano Packaging Technology for Interconnect and Heat Dissipation (NANOPACK)
Start date: Nov 1, 2007, End date: Sep 30, 2011,
One of the major limitations to continued performance increases in the semiconductor and power electronics industries is integration density and thermal management. Continued transistor downscaling is quickly reaching its limits forcing a new focus on heterogeneous integration and 3D packaging technologies to continue performance improvements by reducing interconnect length between memory and mult ...
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